Contact Information:
Email: weiyg@pku.edu.cn
Education:
Ph.D., Solid Mechanics, Tsinghua University
M.S., Engineering Mechanics, University of Mining and Technology of China (Beijing)
B.S., Mechanics, University of Science and Technology of Xian
●B.S., Me
Research Areas:
Trans-scale mechanics of solids;
Theoretical, experimental and size effect studies of materials at micro- and nano scale;
Thin film delamination mechanisms at micro- and nano-scale thickness of films;
Applications of discrete dislocation method to micromechanics analysis;
Inverse problems concerning on microscale;
Strain gradient plasticity and applications;
Elastic-plastic fracture of solids;
Elastic-plastic instability of solid material and structures, etc.
Grants and Awards：
National Natural Science Award, the second prize, 2008, Ranking 1.
Achievement: Researches on micro-plasticity and micro-fracture of solids.
National Natural Science Award, the second prize, 2013, Ranking 2.
Achievement: Researches on the microscopic mechanisms of size effects of mechanics behavior for nano-structured metals.
National Natural Science Award, the third prize, 1995, Ranking 4.
Achievement: Elastic-plastic stress-strain fields and fracture criterion at crack tip.
Selected Publications：
【1】Wei YG,Hutchinson JW. Steady-state crack growth and work of fracture for solids characterized by strain gradient plasticity;Journal of Mech. Phys. Solids, Vol.45, 1253-1273, 1997.
【2】Wei YG,Hutchinson JW. Interface strength，work of adhesion and plasticity in the peel test.Int. Journal of Fracture, Vol.93, 315-333, 1998.
【3】Wei YG, Xu G, A multiscale model for the ductile fracture of crystalline materials;International Journal of Plasticity, Vol.21, 2123-2149, 2005.
【4】Wei YG. A new finite element method for strain gradient theories and applications to fracture analyses.Eur. J. Mech. A/Solids, Vol.25, 897-913, 2006.
【5】Cao AJ,Wei YG, Mao SX. Deformation mechanisms of face-centered-cubic metal nanowires with twin boundaries.Applied Physics Letters, Vol.90, 151909, 2007.
【6】Wei YG;Zhao HF, Peeling experiments of ductile thin films along ceramic substrates --Critical assessment of analytical models. International Journal of Solids & Structures Vol.45, 3779~3792, 2008.
【7】Wu B, Liang LH, Ma HS,Wei YG, A trans-scale model for size effects and intergranular fracture in nanocrystalline and ultra-fine polycrystalline metals,Computational Materials ScienceVol.57, 2–7, 2012.
【8】Liang LH, Li XN, Liu, HY, Wang YB,Wei YG, Power-law characteristics of damage and failure of ceramic coating systems under three-point bending，Surface & Coatings TechnologyVol.285, 113–119, 2016.
【9】Wang GR, Dai ZH, Wang YL, Tan PH, Liu LQ, Xu ZP,Wei YG,Huang R, Zhang Z, Measuring interlayer shear stress in bilayer graphene.Physical Review Letters; Vol.119: 036101, 2017.
【10】Ma HS, Hu GK,Wei YG,Liang LH, Inclusion problem in second gradient elasticity,International Journal of Engineering ScienceVol.132, 60–78, 2018
Pubilications in past five years：
【1】Liang LH, Li XN, Liu, HY, Wang YB,Wei YG, Power-law characteristics of damage and failure of ceramic coating systems under three-point bending，Surface & Coatings TechnologyVol.285, 113–119, 2016.
【2】Wang GR, Dai ZH, Wang YL, Tan PH, Liu LQ, Xu ZP,Wei YG,Huang R, Zhang Z, Measuring interlayer shear stress in bilayer graphene.Physical Review Letters; Vol.119: 036101, 2017.
【3】Ma HS, Hu GK,Wei YG,Liang LH, Inclusion problem in second gradient elasticity,International Journal of Engineering ScienceVol.132, 60–78, 2018
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